Your Innovation.
Build to Scale.
Driven by precision, powered by experience — we deliver die bonding and SMD rework solutions that grow with your needs, from first prototype to automated high-volume production.
Scalable Solutions for Precision Die Bonding
Chosen by leading innovators and companies around the globe!
Bonding Solutions You Can Trust — From First Idea to Full Production.
We know the pressure to scale fast while keeping quality high. That’s why our precision die attach solutions fit seamlessly into your process, reduce risk, and adapt from concept to high-volume production, growing with your success.
Production Bonders - automated high-yield die attach meets technological flexibility
They can be easily adapted to changing technological trends — for a future-proof investment that ensures your production always has the perfect fit.
R&D Bonders - versatile & upgradable
All systems can be flexibly configured to match your application needs and retrofitted for additional tasks at any time. This ensures long-term usability and makes every system a sustainable investment that grows with your project.
Rework Equipment - modular platforms for the complete SMD rework cycle
Our systems handle the full range of SMD components — from small passives to large BGAs — with accuracy, customized tooling and handling, and full control of all process parameters, providing flexibility and future-proof performance.
The Fastest FINEPLACER® for Production
The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus on reduced cost-per-bond and higher UPH.
Innovation is more than just a buzzword for us. It is what drives us.
At Finetech, we have always developed technologies that not only reflect the state of the art but also help shape it. Whether modular systems, AI-based processes, or sustainable system architecture: our innovative strength is a strategic component of our identity.
The Finetech Blog
Insights on die bonding & advanced packaging — where innovative tech meets creative engineering.
// How Packaging Precision Enables the Quantum Internet
Discover how precision packaging and die bonding solutions enable the quantum internet to scale from research to industry. Learn more about challenges, opportunities, and our role in powering quantum communication.
// Finding the Balance: Throughput, Accuracy, and Simplicity in Scalable Photonics Assembly
Integrated photonics powers innovation from data communications to quantum tech. As devices shrink, production must be faster, cost-effective, and precise. Platforms like the FINEPLACER® femto pro demonstrate how balancing speed, accuracy, and simplicity enables scalable, high-yield photonics assembly.
// Leading Through Uncertainty: What Tariffs Taught Us About Agility
When a sudden US-EU tariff hike hit, Finetech had days to react—or face massive costs. Discover how fast decisions turned chaos into clarity.
Latest News
Stay informed about company updates, important announcements, and key developments shaping our company’s direction.
Upcoming Events
Join us at international exhibitions and major industry gatherings, where we present our innovations and network with partners and clients.
Productronica 2025
Trade Fair Center Messe München, Germany
Booth: B2-405
SPIE Photonics West 2026 | 4928
Moscone Center, San Francisco, CA
Booth: 4928
